SMT

F-Series Formic Acid Vacuum Reflow
Formic Acid with Vacuum

The benefits

he High Temperature Vacuum Inline Soldering System provides:

• full convection heating concept
• flexible for different products in the same process
• one general work piece carrier – flexible inlay
• intelligent safety concept
-> closed system
-> N2 atmosphere (100 ppm residual oxygen or less)
-> intelligent gas warning detectors
• efficient vaporizer process (less N2 and formic acid needed)
• 3 heating zones, 3 cooling zones (flexible configuration)
• 3 optional vacuum chambers in heating zones
• cycle time from 90 – 180 s (standard DCB's)
• controllable heat transfer via fan speed

The HTV system can cover different processes
In general, it is a reflow process with/and/or
Atmosphere
• Formic Acid* (CH2O2)
• Hydrogen* (H2) (100 %)
• Nitrogen (N2) (always needed)
Temperature
• High temperature solder*
• SAC 305*
Process
• Vacuum
• Preforms with Flux*
• Preforms without Flux*

Area of Industry & Applications
• Power Electronics
• Semiconductor Industry
• IGBT’s
• DBC
• Substrate
• Preforms
• Die Attach
• Heat spreader attach
• Flux-free soldering
• No oxidation on copper or similar surfaces
• Heatsink